IC-Link by imec, the ASIC and silicon photonics design and manufacturing arm of imec, has expanded its collaboration with TSMC to make advanced-node chip design more accessible via the cloud. The company has joined TSMC’s Open Innovation Platform (OIP) Cloud Alliance, becoming what both partners describe as the first managed-cloud service to support mixed-partner EDA flows for silicon design.
Advanced-node silicon wafers with the IC-Link by imec logo — Image: imec
What’s been announced?
Through a secure cloud environment, IC-Link customers can now get controlled access to advanced TSMC process design kits (PDKs) combined with scalable compute resources sized for semiconductor design workloads. The platform is built around flexible EDA flows:
- design teams can keep using their preferred EDA toolchains and licenses;
- IC-Link provides secure hosting, infrastructure management and access to the required design resources.
The idea is to let teams focus on architecture and product differentiation instead of building and maintaining complex advanced-node design environments.
Why it matters for designers
As process nodes shrink, chip projects for AI, communications, automotive and industrial markets demand more computing power, stricter security and heavier EDA stacks. For many European fabless startups and research groups, setting up an in-house infrastructure for leading-edge TSMC nodes is simply out of reach.
By moving this into a managed cloud model, IC-Link and TSMC aim to:
- lower the entry barrier to advanced-node design;
- shorten time-to-market for smaller engineering teams;
- strengthen semiconductor innovation capacity in Europe and beyond.
The Cloud Alliance membership builds on a long-running partnership: IC-Link has been part of TSMC’s OIP 3DFabric Alliance for advanced packaging and 3D IC, a Value Chain Alliance (VCA) member since 2009 and a Design Center Alliance (DCA) member since 2007. The new step extends that collaboration from manufacturing and packaging deeper into the cloud-based design phase.
Source: imec, eeNews Europe
