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BGA Reballing / SMD Soldering Repair in Baku

BGA reballing and SMD soldering in Baku — GPU/CPU cold solder restoration, chip replacement, micro component soldering and lifted pad repair. The finest circuit board repair work, under a microscope.

Order

Send the make and model and describe the fault briefly. A video helps most — film the fault. Clear photos of the board help too.

Chip restoration with professional BGA equipment (BGA reballing), reflow and SMD soldering. GPU, chipset and memory chip replacement, component transfer from donor boards, and the elimination of cold solder joints and micro-cracks — the finest part of circuit board repair.

How we work

BGA reballing and SMD soldering — a chip's solder ball grid under a microscopeBGA reballing and SMD soldering, the repair in progress — measuring and component solderingBGA reballing and SMD soldering, the typical fault — close up
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Not every device can be repaired

Sometimes restoration is not possible: the chip is discontinued and no spare can be sourced, no donor board is available, the board is severely damaged by fire or liquid, or earlier repair attempts have left it beyond recovery. In such cases we explain the situation plainly and, where possible, suggest an alternative.

BGA reballing means rebuilding the solder balls that connect a chip to the board. It is needed not because the chip has died but because a micro-crack has formed in the solder joint — the device works when warm and dies when cold, or the other way round. This is seen above all on graphics chips (GPU) and chipsets.

We do the work with professional BGA equipment, a preheater from below and a microscope — without all three the board warps and the situation gets worse. The service also covers component transfer from donor boards, memory and chipset replacement, and precise soldering of SMD components.

This is the finest part of circuit board repair, and people often come to us with work another workshop could not manage: restoring lifted solder pads, bringing back a broken trace on a multilayer board, saving a board after an earlier unskilled repair. In such cases we assess the state first and tell you the real chances plainly.

What work we do

BGA reballing — graphics chips (GPU), chipsets, bridge ICs
Reflow — remelting an existing solder joint
Memory chip (BGA) replacement
Component transfer from a donor board
Restoring lifted solder pads
Restoring a broken trace on a multilayer board
Soldering micro SMD components (0402, 0201)
Re-soldering torn-off connectors
Chip work on laptop and console boards
Micro-soldering on phone and tablet boards
Component replacement on industrial boards
Rework and component fitting on prototype boards
Ultrasonic cleaning and corrosion removal
Thermal profile selection and controlled heating

Common faults we repair

  • GPU / CPU cold solder joint restoration
  • BGA reballing and reflow service
  • Chip replacement (from a donor board)
  • Restoring micro-cracks under a chip
  • Memory and chipset replacement (laptop, console)
  • The device works when warm and dies when cold
  • Artefacts and banding on screen (graphics chip)
  • Restoring lifted solder pads
  • Re-soldering a torn-off connector
  • Precise replacement of micro SMD components
  • Saving a board after an earlier unskilled repair
  • Restoring a broken trace on a multilayer board

Typical causes of failure

  • Micro-cracks in the solder balls from heating and cooling cycles
  • Poor factory soldering (a cold joint)
  • A joint broken by the board flexing
  • Adhesive spilled under the chip during an earlier unskilled repair
  • Moisture trapped under the chip vaporising when heated
  • Internal chip damage caused by excessive heat
  • Uncontrolled heat from a hot air gun damaging neighbouring components
  • A connector torn off by impact, lifting the pads

Brands and platforms we work with

ReballingReflowHot AirMicroscopePreheaterBGASMDGPUChipsetDonor boardNvidiaAMDConsolePad repair

How the repair works

  1. 01

    Enquiry and first contact

    Tell us about the fault on WhatsApp or Telegram. We review what you send and let you know whether the device fits the work we take on.

  2. 02

    Acceptance and diagnostics

    If we can take the device on, we confirm it in advance — do not ship it before you have our confirmation. Once it reaches the lab, diagnostics are completed within 48 hours (two working days).

  3. 03

    Estimate and approval

    You receive a report covering the cause of the fault, the estimated cost, spare-part availability and the timeline. Work begins only after you approve it.

  4. 04

    Testing and handover

    After the repair the device runs a minimum 24-hour load test. Once it proves stable in normal operation, we report the result and hand it over.

Diagnostics and pricing

Diagnostics is paid work — 10–50 AZN depending on the complexity of the board. If you have us carry out the repair, that amount is deducted from the final price. An exact repair price is given only after diagnostics and is agreed with you before any work starts.

More about the diagnostic fee

Frequently asked questions

Request a repair

Message us on WhatsApp or Telegram with the BRAND and MODEL of the device and describe the fault in as much detail as you can. A VIDEO helps most: record the fault and explain in your own words what happens. Also send clear photos of the device and, if accessible, of the circuit board from several angles. The more detail you provide, the faster and more accurate our answer.